| Formula |
Designation |
Form (wt %) |
Usage |
| Pd |
Palladium |
Bars 99.95 %
minimum
Sponge/powder 99.95 % minimum
Black ca. 2 % humidity and 98 % Pd |
|
| PdCl2 |
Palladium(II)chlorid |
Powder 59.5 - 60 %
Pd |
Activation of
plastics. |
| H2PdCl4 |
Tetrachloropalladic(II)acid |
Solution with up to
20 % Pd Ammonium salt (ca.37.2 %
Pd) Potassium salt (ca. 32.5 % Pd)
Sodium salt (ca. 36 % Pd) |
Supported catalysts
for chemical and exhaust.
engineering. |
| Pd(NO2)2(NH3)2 |
Dinitrodiamminepalladium(II)
|
Wet powder with 40 %
Pd |
Electroplating |
| PdCl2(NH3)2 |
Dichlorodiamminepalladium(II) |
Powder (ca. 50 %
Pd) |
Electroplating |
| Pd(NH3)4SO4
x H2O |
Palladiumtetraaminsulphate |
Crystals (ca. 32 %
Pd) |
Electroplating |
| Pd(NO3)2 |
Palladiumnitrate |
Powder (ca. 46 %
Pd) Solution up to 15 % Pd |
Catalysts.
Exhaust catalysts. |
| Pd(NH3)4Cl2 |
Palladium(II)tetramminechloride |
Solid (ca. 43 % Pd)
Solution (ca. 10 % Pd) |
|
| Pd(NH3)4(NO2)2 |
Palladium(II)tetramminenitrite |
Solution up to 100 gm
Pd / l |
|
| H2PdCl6 |
Hexachloropalladic(II)acid |
Solution ca. 20 %
Pd Ammonium salt ca. 29.5 % Pd
Potassium salt ca. 26.4 % Pd |
|
| (NH4)2Pd(SO3)2 |
Pd additive |
Solution 100 g Pd /
l |
Alloying
(NH4)3Au(SO3)2 electroplating
baths. |